Analysis of Metallic Impurities in Si Wafers Using Fully Automated VPD-ICP-MS


In this webcast, Tatsu Ichinose, Technical Manager at IAS Inc., discusses the analysis and control of ultra-trace level metallic impurities in production and throughout the manufacturing processes for Si wafer utilizing a fully automated VPD-ICP-MS for 24/7. Interesting analyses of note include:

  • System integration with full automated material handling systems (AMHS) has been running 24/7 for more than 10 years
  • In addition to oxide and nitride films, bulk Si and depth profile analysis can also be performed
  • Notable metals such as Au, Pt, Ag, Ru, and Pd
  • Analysis of wafer edge area

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