From your automobile and EVs of the future, to your alarm clock, the recent semiconductor shortage is creating chaos in our industrial and consumer product supply chains. As demands for computers, remote working devices, displays, and mobile phones rose to meet the needs of a remote workforce, the mighty semiconductor remains at the center of the electronics manufacturing disruption.
In this Virtual Symposium, “Controlling Semiconductor Impurities: From R&D to FAB and Back-End Assembly”, industry experts demonstrate how manufacturing innovations and analytical solutions are driving the future of quality semiconductors, while controlling impurities in the hundreds of fine chemicals and materials utilized. Here, we have collected the webinars for your convenience; click any of the topics to watch the webinars.
An introduction to production processes for the semiconductor and electronics industry, how the industry has evolved from a 12 nm die process to 3 nm, and the resulting materials selection requirements.
PerkinElmer's Ewa Pruszkowski, discusses the benefits and key features of the NexION® 5000 multi-quadrupole ICP-MS and how it meets and exceeds the demanding requirements of ultra-trace elemental applications.
Katsu Kawabata, President, IAS Inc. discusses metallic contamination control in semiconductor FAB and the preferred fully automated systems utilizing (VPD)-ICP-MS, online-ICP-MS and (GED)-ICP-MS.
In this webcast, Tatsu Ichinose, Technical Manager at IAS Inc. discusses the analysis and control of ultra-trace level metallic impurities in production and throughout the manufacturing processes for Si wafer utilizing a fully automated VPD-ICP-MS for 24/7.
Discover the versatility of FTIR technology to solve semiconductor analysis challenges such as raw material ID, chemical supply chain QA/QC, final product analyses, and silicon wafer characterization.
This presentation highlights key insights and commonly used TGA, TMA, and DMA techniques for the semiconductor industry, and reviews several applications with these techniques.
Industry expert and Principal Application Scientist examines Airborne Molecular Contamination (AMC) classifications, common sources of AMCs and their effects on semiconductor FAB.
This topics and discussion article stems from questions and answers asked by customers whom attended this virtual symposium. Topics include why hyphenation techniques, GC/MS and ICP-MS are important to semiconductor quality, QA/QC in manufacturing and failure analysis and final product quality, and more.