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In this webcast, Chady Stephan provides an introduction to production processes for the semiconductor and electronics industry, how the industry has evolved from a 12 nm die process to 3 nm, and the resulting materials selection requirements. As more major consumer, industrial and healthcare electronics manufacturers evolve to deliver the lightest, smallest and safest products; they utilize the next die shrink process and impurity management systems, requiring lower detection limits and methods to meet the needs of their semiconductor R&D, fabs, chemicals supply chain, and back-end fabrication assembly.
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