The DSC 4000 offers dependable performance and quality results. This single-furnace, heat flux DSC is designed to run all your routine applications and includes an easy-to-load vertical furnace that is resistant to oxygen and chemical corrosion.
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Typical applications for the DSC 4000:
|21 CFR Part 11 Compatible||Yes|
|Maximum Temperature||450 °C|
|Minimum Temperature||-100 °C|
|Technology Type||Thermal Analysis|
Differential scanning calorimetry (DSC) is a commonly used technique for studying polymeric; pharmaceutical; and energetic; materials. When considering which type of DSC to use to perform a specified measurement one typically chooses either a Power Compensation, or heat flux design.
Application Note, DSC 4000, PVC, Gelation, Processig Temperature, Sample, Thermal
The PerkinElmer Pyris Power Compensation DSC provides high sensitivity and unsurpassed resolution necessary to detect polymorphism exhibited by many pharmaceutical materials.
OIT is the abbreviation for oxidative induction time. It provides information about the oxidative stability of mainly polymer materials. The information is important because plastic parts age throughout their lifetime due to exposure to environmental elements such as heat, oxygen, light and radiation. Aging causes the degradation of the physical properties of the polymers and will lead to their failure.
This application note describes HyperDSC™ as a DSC analysis technique by PerkinElmer with fast scanning rates enabling increased sensitivity and high throughput for applications in polymers and pharmaceuticals.
StepScan DSC is a temperature modulated,DSC technique that operates in conjunction,with the Power Compensation Diamond,DSC from PerkinElmer. The approach,applies a series of short interval heating,and isothermal hold steps to cover the temperature range of interest. With the,StepScan™ DSC approach, two signals are obtained: the Thermodynamic Cp,signal represents the thermodynamic aspects of the material, while the Iso K,signal reflects the kinetic nature of the sample during heating. The following,basic equation mathematically describes the StepScan DSC approach:
There are many levels of integration of Thermal Analysis in the Semiconductor Packaging Industry. The encapsulation material used is typically an epoxy based compound (epoxy mold compound, under-fill epoxy, silver die attach epoxy, glob top epoxy, etc.)
The differential scanning calorimeter (DSC) is a fundamental tool in thermal analysis. It can be used in many industries - from pharmaceuticals to polymers and from nanomaterials to food products. The information these instruments generate is used to understand amorphous and crystalline behavior, polymorph and eutectric transitions, curing and degree of cure, and many other material properties used to design, manufacture and test products.
Guide describing all UV/Vis spectroscopy, FT-IR spectroscopy, thermal analysis, hyphenation technique solutions for material characterization.
Poster summarizing solutions of thermal analysis, molecular spectroscopy, chromatography and hyphenated techniques for polymers focused on providing more insight into product performance and process optimization that make easier
For over 40 years, PerkinElmer has offered the highest-quality thermal analysis products, and is recognized as a worldwide leader and innovator of thermal analysis instrumentation.