The TGA 4000 is designed with a compact ceramic furnace, which provides the temperature control you need for accurate results. Its rugged design is also corrosion resistant for the applications flexibility you need today and tomorrow.
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Typical TGA Applications:
Features & Benefits
|21 CFR Part 11 Compatible||Yes|
|Maximum Temperature||1000 °C|
|Model Name||TGA 4000|
|Technology Type||Thermal Analysis|
A gas chromatographic analysis of the extract can provide even greater sensitivity and more detailed compositional information, but further increases the time required for the analysis. Thermogravimetric analysis coupled to infrared spectroscopy (TG-IR) can provide detailed information about the amount and nature of the pollution, while requiring no sample preparation at all. This application note illustrates the kind of data that can be obtained with a modern TG-IR system.
One of the most challenging analytical problems with increasing importance is the possibility to analyze soil polluted by the dispersion of organic fluids which sometimes features particularly high boiling points. The current techniques used solvent extraction and headspace chromatographic analysis, have shown their limits. Solvent extraction needs time consuming sample preparation. Headspace makes it impossible to heat the sample at temperatures exceeding 200 °C, which risks not being able to identify the heaviest fractions of the polluting agents.
A valuable application of thermal analysis (TEA) is for the characterization of electronic materials and components, including printed circuit boards (PCB) and encapsulants. The key properties that TEA can help address are softening temperature or Tg, completeness of cure, degree of cure, rate of cure, compositional analysis, degradation temperatures for stability assessment, expansivities, coefficients of thermal expansion, modulus (stiffness) and damping properties. PerkinElmer offers a complete line of state-of-the-art thermal analysis instruments (DSC, TGA, TMA and DMA) for the analysis and characterization of the critical thermal, physical, degradation and mechanical properties of electronic materials. The results are highly useful for research and development as well as quality assurance applications.
Thermal analysis comprises a series of powerful techniques for the characterization of the thermal, physical, mechanical and degradation properties of materials. One valuable application of thermal analysis is for the characterization of electronic materials and components, including printed circuit boards (PCB) and encapsulants.
Thermogravimetric analysis (TGA) is one of the members of the family of thermal analysis techniques used to characterize a wide variety of materials. TGA provides complimentary and supplementary characterization iinformation to the most commonly used thermal technique, DSC.
Thermogravimetric analysis (TGA) is one of the members of the family of thermal analysis techniques used to characterize a wide variety of materials. TGA provides complimentary and supplementary characterization information to the most commonly used thermal technique, Differential Scanning Calorimetry (DSC). PerkinElmer offers a variety of high performance TGA instruments encompassing a wide range of application needs and operational requirements. The extended capabilities of the PerkinElmer TGA, as a valuable tool for polymeric characterization and quality assurance are demonstrated by these applications.
Thermogravimetric analysis (TGA) is a common technique that is used to study the weight loss during heating. It can tell you the percentage of weight loss quantitatively and accurately. But TGA alone will not tell you anything about the chemical components of the evolved off gas. The hyphenation between TGA and FT-IR is able to identify the off gas from TGA and give a more complete picture of material characterization. The TG-IR hyphenation technique has been widely used for the polymer industry. This application note demonstrates how to combine the strength of TGA and FT-IR analysis to offers a more comprehensive material characterization.
Today’s plastics are some of the most used materials on a global volume basis. Broadly integrated into today’s industrial and commercial lifestyles, they make a major, irreplaceable contribution to virtually every product category.
In this compendium you will find a wide range of applications for polymers, plastics, rubbers and advanced materials. Discover how to put these applications to work for you simply and efficiently.
The regulations of 21 CFR Part 11 cover overall system compliance and include administrative, procedural and technical elements. Software alone cannot be compliant without the development and implementation of the other elements. PerkinElmer’s Pyris™ Enhanced Security software for Thermal Analysis instruments provide features that, when coupled with appropriate policies and procedures, fulfill the requirements for 21 CFR Part 11 compliance.
The Thermogravimetric Analyzer (TGA) is an essential laboratory tool used for material characterization. TGA is used as a technique to characterize materials used in various environmental, food, pharmaceutical, and petrochemical applications. This booklet provides an introduction to the concepts of Thermogravimetric Analysis (TGA). It is written for scientists unfamiliar with TGA.
Guide describing all UV/Vis spectroscopy, FT-IR spectroscopy, thermal analysis, hyphenation technique solutions for material characterization.
Poster summarizing solutions of thermal analysis, molecular spectroscopy, chromatography and hyphenated techniques for polymers focused on providing more insight into product performance and process optimization that make easier
The Polymer Market consists of a huge diversity of manufacturers of industrial products running many different processes yet still facing similar challenges. There is more and more pressure to achieve high product quality and reduce costs in order to stay one step ahead of the competition.
Product Note, Thermal Analysis, Polymenr Recycling Pack, Polyethylene Terephthalate, PET, polyethylene, PE, Polycarbonate, PC, Polystyrene, PS, Spectrum Two, Fourier Transform Infrared, FT-IR, Universal Attenuated Total Relectance, UATR, High Density Polyethylene, HDPE, Low Density Polyethylene LDPE, Differential Scanning Calorimetry, DSC, Thermogravimetric Analysis, TGA, Thermal Analysis