The DMA 8000 is flexible and cost effective. Its innovative design, high functionality, and flexible operation make it ideal for advanced research and routine quality testing in the polymers, composites, pharmaceutical, and food industries.
Please enter valid quantity
Please login to add favorites
NULL OR EMPTY CART
You successfully added item(s) to your cart
|Dynamic Range||0 to 600 Hz|
|Maximum Temperature||400 °C|
|Minimum Temperature||-190 °C|
|Technology Type||Thermal Analysis|
Thermal analysis comprises a series of powerful techniques for the characterization of the thermal, physical, mechanical and degradation properties of materials. One valuable application of thermal analysis is for the characterization of electronic materials and components, including printed circuit boards (PCB) and encapsulants.
Dynamical Mechanical Analysis (DMA) is a very important tool in the modern polymer laboratory despite the fact that only a few books have concentrated on this technique. DMA Basics Part 1 and Part 2 review the basic mathmatics of DMA, DMA operating principal.
The new PerkinElmer® DMA 8000 allows accuracy and precision measurements of the transitions seen in thermoplastics. These transitions, caused by molecular motions and free volume changes, define how a polymer will behave at a certain temperature. Dynamic Mechanical Analysis (DMA) is a powerful technique for studying these transitions.1
The mechanical properties of pasta are very important. In its dried form, it is very brittle and quite stiff. If introduced into a humid environment and heated, the properties of the pasta change dramatically. This application, note will investigate the effect of humidity on pasta under isothermal and temperature scanning conditions.
The effects of radiation on polymeric materials is a topic of concern in a range of industries including the sterilization1, medical devices2, food preparation3, and the nuclear power industry4. While much work has concentrated systems like polyolefins that are radiation sterilized1, some work has been done on epoxy systems.The use of fillers to attempt to protect the matrix from radiation is known6 but to our knowledge has not been applied to epoxies. In this work, we use the ferrochromium alloy called ferrochrome (FeCr) as a filler and examine the effect of radiation on the polymer
The use of the PerkinElmer DMA 8000 for the analysis of the a (Tg) relaxation of epoxy resin paint samples is demonstrated in this application note. The resin used for these experiments was used as a corrosion inhibiting coating for marine applications.
The coefficient of thermal expansion (CTE) is an important property of materials. If the material is to be exposed to temperature gradients in its lifetime, it is often important to determine how much it will expand or contract over the temperature range. This application note details the method to be determine the expansion coefficient of two polymers mounted in the PerkinElmer DMA 8000 in tension mode.
This application note demonstrates the ability of the PerkinElmer® DMA 8000 to investigate the mechanical properties of an adhesive, without the need to fabricate a self supporting film.
All materials have a resonance frequency. Often this is of little concern as it is above the normal practical mechanical frequencies that the material will be exposed to. It can be important if the material is to be used in an environment where high frequency mechanical stress is applied, such as engine mounts in a car or some aeronautical applications.
Dynamic Mechanical Analysis (DMA) is a technique used to investigate the stiffness of materials as a function of temperature, humidity, dissolution media or frequency. A mechanical stress is applied to the sample and the resultant strain is measured by the instrument. These parameters are used to evaluate glass transitions, degree of crystallinity and stiffness behavior of the sample.
This application note demonstrates the ability of DMA to characterize the mechanical properties of an epoxy based printed circuit board (PCB) using a PerkinElmer® DMA 8000.
The characterization of polybutadiene will be demonstrated in this application note.
Bitumen shingles are used as a common roofing material. Polymer additives are frequently used to enhance the performance and durability of the product. This application note will show the DMA response from two shingles with different additives.
Determination of the glass transition temperature of viscous liquids is a challenge by mechanical methods. Traditionally, it is performed using Shear geometry, but this can be problematical with the material liable to flow at room temperature.
The PerkinElmer® Material Pocket has been proposed as a mechanism to support non-rigid materials within the PerkinElmer DMA 8000.
A powder-filled, epoxy-based composite material is investigated in this application note. A multi-frequency thermal scan will give information about the glass transition and cure of the material.
DMA works by applying an oscillating force to the material and the resultant displacement of the sample is measured. From this, the stiffness can be determined and the modulus and tan d can be calculated.
Lactose is a very important pharmaceutical excipient used in tablet and inhalation products. It is prone to forming amorphous regions on processing however; and; it can be problematical to characterize amorphic material in a sample. Differential Mechanical Analysis (DMA) with material pocket is a method which can be used to accurately determine very low levels of amorphous content in lactose (Royall 2005; Mahlin 2009); due to the high sensitivity of DMA to glass transitions. The material pocket facilitates the analysis of lactose in the powder form; resulting in a very powerful tool for the analysis of mixtures of crystalline and amorphous lactose.
There are many levels of integration of Thermal Analysis in the Semiconductor Packaging Industry. The encapsulation material used is typically an epoxy based compound (epoxy mold compound, under-fill epoxy, silver die attach epoxy, glob top epoxy, etc.)
Traditionally approaches to studying the curing of epoxies concentrate on the thermo-chemical1 and thermo-rheological properties of the material. As changes in the glass transition temperature (Tg) correlate strongly with functional properties3 like mechanical strength, tribology, permeability, etc, studies on epoxies often rely on techniques like Differential Scanning Calorimeter (DSC) and Dynamic Mechanical Analysis (DMA) to quantify it. DSC also allows one to characterize the degree of cure in a thermoset and to determine the kinetics of the cure4. DMA can characterize the rheology profile of the cure5 as well as the final modulus and Tg values after curing. In many cases, the greater sensitivity of the DMA to the presence of the Tg makes it the preferred method for epoxies studies.Traditionally approaches to studying the curing of epoxies concentrate on the thermo-chemical1 and thermo-rheological properties of the material. As changes in the glass transition temperature (Tg) correlate strongly with functional properties3 like mechanical strength, tribology, permeability, etc, studies on epoxies often rely on techniques like Differential Scanning Calorimeter (DSC) and Dynamic Mechanical Analysis (DMA) to quantify it. DSC also allows one to characterize the degree of cure in a thermoset and to determine the kinetics of the cure4. DMA can characterize the rheology profile of the cure5 as well as the final modulus and Tg values after curing. In many cases, the greater sensitivity of the DMA to the presence of the Tg makes it the preferred method for epoxies studies.Traditionally approaches to studying the curing of epoxies concentrate on the thermo-chemical1 and thermo-rheological properties of the material. As changes in the glass transition temperature (Tg) correlate strongly with functional properties3 like mechanical strength, tribology, permeability, etc, studies on epoxies often rely on techniques like Differential Scanning Calorimeter (DSC) and Dynamic Mecha
The Material Pocket is a stainless steel envelope that holds the sample so it can be mounted in a DMA 8000 instrument. As stainless steel does not have any relaxations or phase transitions over the temperature range of the instrument, this is an ideal sample mounting material.
Time-Temperature Superposition (TTS) analysis allows DMA data to be applied to data collected within the measuring range of the DMA 8000 (0.001 Hz to 600 Hz) to allow modelling of material behavior at much higher or lower frequencies, which may be more representative of “real world” applications. At the low frequency end of the frequency spectrum, “creep” measurements may be carried over many months or even years, however modelled data from DMA using TTS can give an indication of long-term behaviour in a very short time. Similarly, higher frequencies such as those which represent “impact”, typically in the kHz range, can be investigated quickly and easily using DMA in a way which allows meaningful comparisons between different sample treatments or modifications to be assessed.
Dynamic Mechanical Analysis (DMA) is widely used to characterize materials' bulk properties such as modulus, compliance, and damping (tan delta). It measures changes of rheological behavior under dynamic conditions as a function of temperature, time, frequency, stress, atmosphere or a combination of these parameters.
PerkinElmer has been helping Renault F1 Team's Enstone Technical Center with their analytical needs for nearly 30 years. PerkinElmer began by outfitting the team’s testing lab with the analytical instrumentation needed to conduct materials testing. Today, a dedicated PerkinElmer scientific laboratory operates within the team’s Enstone facility where the latest thermal analysis, infrared spectroscopy, and imaging technologies are being utilized for proactive monitoring, issue prevention, and performance enhancement of the team’s single seater. This case study shows you how we offer analytical expertise in helping Renault F1 Team master the thermal stability challenge.
This booklet is a beginner's guide to DMA. It contains the top 20 questions about DMA and an introductory glossary of DMA concepets. It is written for the thermal analyst unfamiliar with DMA.