Application Note

Thermal Analysis Applications in the Semiconductor Packaging Industry


The assembly and packaging phase of semiconductor manufacturing requires failure analysis and quality control processes which are of critical importance to final product quality and performance. Analytical measurements like Thermal Analysis allows users to analyze the thermal behavior of epoxies used in packaging, provides insights into material selection like slight weight changes used to measure important mate¬rial parameters like outgassing properties and thermal stabil¬ity, measure dimensional changes in material when subject to a temperature program, and many more.

Learn how Thermal Analyses applications can lead to great cost savings for semiconductor R&D and QA/QC.