A major source of failure in electronic circuits is thermal expansion, and the problems it causes. To prevent this, electrical engineers employ thermal conductors to dissipate the heat, and use low expansivity materials to match the low expansion rate of silicon chips and ceramic insulators. Thermomechanical analysis (TMA) has long been used to measure thermal expansion (CTE) of circuit boards, electronic components, and component materials. This application note demonstrates how challenging samples from the electronics industry are accurately analyzed with the PerkinElmer TMA 4000 using standard methods.