Nexion 5000 Resources
For many years, inductively coupled plasma mass spectrometry (ICP-MS) has been the tool of choice for the trace analysis of elements like lead (Pb), arsenic (As), mercury (Hg), and copper (Cu) in bodily fluids such as urine, blood, serum and saliva, as well as in tissues.
For decades, the semiconductor industry has been designing new devices that are smaller, faster and consume less power than their predecessors. To maintain this trend, the critical features of these devices must also become smaller and have fewer defects.
Contaminants in chemicals used during manufacturing processes have a direct impact on product yield and reliability of semiconductor devices. Within the whole process of integrated circuit manufacturing, wafers are sent for repeated cleaning using hydrogen peroxide (H2O2).
The production of electronic devices is a complex process that requires the use of ultra-pure chemicals during the manufacturing steps. High-purity-grade sulfuric acid (H2SO4) is generally used for cleaning components and etching all metal and organic impurities on silicon wafers.